Board and system level effects on plastic package thermal performance

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 911-914

  Zhou, Tiao ^a   Hundt, Michael ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT TRANSFER; MICROPROCESSOR CHIPS; PERFORMANCE; PLASTICS APPLICATIONS; PRINTED CIRCUIT DESIGN; SENSITIVITY ANALYSIS; THERMOANALYSIS;

PLASTIC PACKAGE; THERMAL PATH ANALYSIS; THERMAL PERFORMANCE;

PRINTED CIRCUIT BOARDS;

EID: 0029712390     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)