X-ray microdiffraction as a probe to reveal flux divergences in interconnects

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 288-295

  Spolenak, R ^a   Tamura, N ^b   Patel, J R ^b,c  

^a ETH ZURICH   (Switzerland)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c Stanford University   (United States)

Author keywords

Copper; Critical product; Electromigration; Laue microdiffraction; Surface diffusion

Indexed keywords

EID: 33751226602     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173561     Document Type: Conference Paper

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