Impact of narrow trench geometries on copper film crystallography

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2208-2212

  Brunoldi, G ^a   Kozaczek, K J ^b   Gittleman, B ^b   Marangon, T ^a  

^a STMICROELECTRONICS   (Italy)

^b Hypernex Inc   (United States)

Author keywords

Barrier layer; Copper electroplating; Crystallographic texture; Trench geometry; X ray diffraction

Indexed keywords

COMPUTATIONAL GEOMETRY; COPPER; CRYSTALLOGRAPHY; ELECTROPLATING; SILICON WAFERS; X RAY DIFFRACTION ANALYSIS;

BARRIER LAYERS; COPPER ELECTROPLATING; CRYSTALLOGRAPHIC TEXTURE; TRENCH GEOMETRY;

THIN FILMS;

EID: 33751212789     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.005     Document Type: Article

References (18)

1. Koike J., Wada M., Sanada M., and Maruyama K. Appl. Phys. Lett. 81 6 (2002) 1017-1019
2. Sekiguchi A., Koike J., and Maruyama K. Appl. Phys. Lett. 83 10 (2003) 1962-1964
3. Vanasupa L., Young-Chang Joo J., Besser P.R., and Pramanick S. J. Appl. Phys. 85 5 (1999) 2583-2590
4. Vanasupa L., et al. Electrochem. Solid-State Lett. 2 6 (1999) 275-277
5. Zenert I., Besser P., Blum W., and Zschech E. Mat. Res. Soc. Symp. Proc. 672 (2001) O7.9.1-O7.9.6
6. Geisler H., et al. In: Seidler D.G., et al. (Ed). Characterization and Metrology for ULSI Technology 2003 (2003), IAP, Melville, NY 469
7. Mirpuri K., and Szpunar J. Mater. Charact. 54 2 (2005) 107-122
8. Lee H., Lopatin S.D., Dae-Yong K., Dubin V.M., and Wong S.S. Conf. Proc. (2000) 63-68
9. Vas'ko V.A., Tabakovic I., Riemer S.C., and Kief M.T. Microelectron. Eng. 75 1 (2004) 71-77
10. C.E. Murray, K.P. Rodbell, P.M. Vereecken, Thin Solid Films, in press.
11. Kozaczek K.J., Murray C.E., and Rodbell K.P. Diffus. Defect Data Part B (Solid State Phenomena) 105 (2005) 391-396
12. J. Chen et al., in: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) (2002) 185-187.
13. Kozaczek K.J., et al. In: Seidler D.G., et al. (Ed). Characterization and Metrology for ULSI Technology 2003 (2003), IAP, Melville, NY 485
14. Guerrieri, C. Bresolin, T. Marangon, in: Proceedings of Materials for Advanced Metallization Conference 2006, Grenoble, in press.
15. Lee H.J., et al. Thin Solid Films 474 (2005) 250-254
16. Rossnagel S.M. J. Vac. Sci. Technol. B 20 (2002) 2328
17. Sandquist B.E. Acta Metall. Mater. 12 (1964) 67
18. Lee D.N., and Lee H.J. J. Electron. Mater. 32 (2003) 1012