Barrier crystallographic texture control and its impact on copper interconnect reliability

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 185-187

  Chen, Jay ^a   Parikh, S ^a   Vo, T ^a   Rengarajan, S ^a   Mandrekar, T ^a   Ding, Peijun ^a   Chen, Ling ^a   Mosely, R ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; CRYSTAL STRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SURFACE DEFECTS; WETTING; X RAY DIFFRACTION;

COPPER INTERCONNECTS; CRYSTALLOGRAPHIC TEXTURES; FILM PROPERTIES; FILM SURFACE MORPHOLOGY; INTERCONNECT RELIABILITY; INTERCONNECTION RELIABILITY; STRESS MIGRATION TESTS; WETTING PROPERTY;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84961743090     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014928     Document Type: Conference Paper

References (5)

1. D. Edelsein, et al. IEEE, 2001 pp 9-11
2. B.L. Chin, et al. Semiconductor International, May, 2001.
3. C.K. Hu, Thin Solid Films 262, 1995 pp 84-92
4. C.V. Thompson, Acta Metall. 36, 2929 (1988)
5. S. Parikh et al. IITC Procedings 2001, 133.