Process-microstructure-properties relationship during formation of AIN layers by physical vapour deposition

Surface Engineering

Volumn 22, Issue 2, 2006, Pages 109-120

  Figueroa, U ^a   Salas, O ^a   Oseguera, J ^a  

^a SCHOOL OF ENGINEERING AND SCIENCES   (Mexico)

Author keywords

AIN columnar structure; AIN film hardness; AIN film orientation; AIN films; AIN growth morphology; AIN structural properties; Aluminium nitride; Film residual stresses; Plasma processing and deposition; Reactive magnetron sputtering

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; MAGNETRON SPUTTERING; MICROSTRUCTURE; PHYSICAL VAPOR DEPOSITION; PRESSURE EFFECTS; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

FILM HARDNESS; FILM ORIENTATION; GROWTH MORPHOLOGY;

ALUMINUM NITRIDE;

EID: 33749423372     PISSN: 02670844     EISSN: None     Source Type: Journal    
DOI: 10.1179/174329406X98449     Document Type: Article

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