메뉴 건너뛰기




Volumn 2006, Issue , 2006, Pages 384-389

Implementing register files for high-performance microprocessors in a die-stacked (3D) technology

Author keywords

[No Author keywords available]

Indexed keywords

DIE STACKED (3D) TECHNOLOGY; ENERGY REDUCTION; REGISTER FILES; WIRE DOMINATED CIRCUITS;

EID: 33749333423     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISVLSI.2006.56     Document Type: Conference Paper
Times cited : (18)

References (29)
  • 1
    • 0000793139 scopus 로고
    • Cramming more components onto integrated circuits
    • April
    • G. B. Moore, "Cramming More Components Onto Integrated Circuits," Electronics, April 1965.
    • (1965) Electronics
    • Moore, G.B.1
  • 5
    • 0032592096 scopus 로고    scopus 로고
    • Design challenges of technology scaling
    • July
    • S. Borkar, "Design Challenges of Technology Scaling," IEEE Micro Magazine, vol. 19, no. 4, pp. 23-29, July 1999.
    • (1999) IEEE Micro Magazine , vol.19 , Issue.4 , pp. 23-29
    • Borkar, S.1
  • 7
    • 0030243819 scopus 로고    scopus 로고
    • Energy dissipation in general purpose microprocessors
    • September
    • R. Gonzalez and M. Horowitz, "Energy Dissipation in General Purpose Microprocessors," IEEE Journal of Solid-State Circuits, vol. 31, no. 9, pp. 1277-1284, September 1996.
    • (1996) IEEE Journal of Solid-State Circuits , vol.31 , Issue.9 , pp. 1277-1284
    • Gonzalez, R.1    Horowitz, M.2
  • 8
    • 0032592098 scopus 로고    scopus 로고
    • Deep-submicron microprocessor design issues
    • July
    • M. J. Flynn, P. Hung, and K. W. Rudd, "Deep-Submicron Microprocessor Design Issues," IEEE Micro Magazine, vol. 19, no. 4, pp. 11-22, July 1999.
    • (1999) IEEE Micro Magazine , vol.19 , Issue.4 , pp. 11-22
    • Flynn, M.J.1    Hung, P.2    Rudd, K.W.3
  • 16
    • 84859290996 scopus 로고    scopus 로고
    • Tezzaron Semiconductor, "WWW Site," http://www.tezzaron.com.
  • 20
    • 2942639675 scopus 로고    scopus 로고
    • Technology, performance, and computer-aided design of three-dimensional integrated circuits
    • Phoenix, AZ, USA, April
    • S. Das, A. Fan, K.-N. Chen, and C. S. Tan, "Technology, Performance, and Computer-Aided Design of Three-Dimensional Integrated Circuits," in Proceedings of the International Symposium on Physical Design, Phoenix, AZ, USA, April 2004, pp. 108-115.
    • (2004) Proceedings of the International Symposium on Physical Design , pp. 108-115
    • Das, S.1    Fan, A.2    Chen, K.-N.3    Tan, C.S.4
  • 24
    • 0032639289 scopus 로고    scopus 로고
    • The alpha 21264 microprocessor
    • March-April
    • R. E. Kessler, "The Alpha 21264 Microprocessor," IEEE Micro Magazine, vol. 19, no. 2, pp. 24-36, March-April 1999.
    • (1999) IEEE Micro Magazine , vol.19 , Issue.2 , pp. 24-36
    • Kessler, R.E.1
  • 28
    • 2442452519 scopus 로고    scopus 로고
    • 2.5D system integration: A design driven system implementation schema
    • Yokohama, Japan, January
    • Y. Deng and W. Maly, "2.5D System Integration: A Design Driven System Implementation Schema," in Proceedings of the Asia South Pacific Design Automation Conference, Yokohama, Japan, January 2004, pp. 450-455.
    • (2004) Proceedings of the Asia South Pacific Design Automation Conference , pp. 450-455
    • Deng, Y.1    Maly, W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.