Interfacial adhesion of thin-film patterned interconnect structures

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 168-170

  Litteken, C ^a   Dauskardt, R ^a   Scherban, T ^b   Xu, G ^b   Leu, J ^b   Gracias, D ^b   Sun, B ^b  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Adhesives; Copper; Dielectric thin films; Energy dissipation; Materials science and technology; Mechanical factors; Plastics; Polymer films; Residual stresses; Transistors

Indexed keywords

ADHESION; ADHESIVES; ASPECT RATIO; COPPER; DIELECTRIC MATERIALS; ENERGY DISSIPATION; FILMS; FRACTURE; FRACTURE MECHANICS; INTERFACES (MATERIALS); PLASTIC ADHESIVES; PLASTICS; POLYMER FILMS; RESIDUAL STRESSES; STRESSES; TRANSISTORS;

DEBONDED INTERFACES; DIELECTRIC THIN FILMS; INTERCONNECT STRUCTURES; INTERFACIAL ADHESIONS; MATERIALS SCIENCE AND TECHNOLOGY; MECHANICAL FACTORS; PATTERNED THIN FILM STRUCTURES; THIN-FILM GEOMETRY;

THIN FILMS;

EID: 84944028306     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219744     Document Type: Conference Paper

References (5)

1. M. Lane, A. Vainchtein, H. Gao, and R. H. Dauskardt, "Plasticity Contributions to Interface Adhesion in Thin-Film Interconnect structures," J. Mat. Res., 15 [12], 2758-2769, 2000.
2. R. J. Hohlfelder, D. A. Maidenberg, R. H. Dauskardt, Y. Wei, and J. W. Hutchinson, "Adhesion of Benzocyclobutine-Passivated Silicon in Epoxy Layered Structures," J. Mat. Res., 16 [1], 243-255, 2000.
3. M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, "Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers," J. Mat. Res., 15 [1] 203-211, 2000.
4. S. Stroband and R. H. Dauskardt, "Interface Separation in Residually Stressed Thin-Film Structures," Interface Science special issue on "Mechanics of Interfaces" 2002. In press.
5. C. Litteken and R. H. Dauskardt, "Adhesion of Polymer Thin-Films and Patterned Lines," Int. J. Fract., 2002. In press.