Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

International Journal of Fracture

Volumn 120, Issue 1-2, 2003, Pages 421-429

  Scherban, T ^a   Pantuso, D ^a   Sun, B ^a   El Mansy, S ^a   Xu, J ^a   Elizalde, M R ^b   Sanchez J M ^b   Martinez Esnaola J M ^b  

^a INTEL CORPORATION   (United States)

^b CEIT   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FINITE ELEMENT METHOD; MICROELECTRONICS; SURFACE CHEMISTRY; THIN FILMS;

INTERFACIAL ADHESION;

FRACTURE;

ADHESION; FRACTURE;

EID: 0141705690     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1024931913643     Document Type: Article

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