Cracking and debonding in integrated microstructures

Materials Research Society Symposium - Proceedings

Volumn 516, Issue , 1998, Pages 313-324

  Liu, X H ^a   Suo, Z ^a   Ma, Q ^a   Fujimoto, H ^a  

^a PRINCETON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELASTICITY; FRACTURE MECHANICS; INTERFACIAL ENERGY; STRESS ANALYSIS; TENSILE STRESS;

INTEGRATED MICROSTRUCTURES;

MICROELECTRONICS;

EID: 0032317689     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-516-313     Document Type: Conference Paper

References (16)