Models of interface separation accompanied by plastic dissipation at multiple scales

International Journal of Fracture

Volumn 95, Issue 1-4, 1999, Pages 1-17

  Wei, Yueguang ^a   Hutchinson, John W ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

Adhesion; Fracture; Interface strength; Interface toughness; Plasticity

Indexed keywords

ADHESION; BONDING; CONTINUUM MECHANICS; CRACK PROPAGATION; ELASTOPLASTICITY; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MECHANICAL VARIABLES MEASUREMENT; PLASTIC DEFORMATION; STRAIN;

EMBEDDED PROCESS ZONE MODEL; INTERFACE STRENGTH; INTERFACE TOUGHNESS; PLASTIC DISSIPATION; STRAIN GRADIENT PLASTICITY;

FRACTURE MECHANICS;

EID: 0033320977     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1007/978-94-011-4659-3_1     Document Type: Article

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