Cost-effective machining of brittle materials (glasses and ceramics) eliminating/minimizing the polishing process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3099, Issue , 1997, Pages 46-58

  Carlisle, Keith ^a   Stocker, M A ^a  

^a Cranfield Precision   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST EFFECTIVENESS; EMBRITTLEMENT; GLASS; MACHINING; POLISHING; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE;

EDGE GRINDING; SILICON WAFERS;

OPTICAL MATERIALS;

EID: 0031322454     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)