Fine grinding of silicon wafers: A mathematical model for the wafer shape

International Journal of Machine Tools and Manufacture

Volumn 44, Issue 7-8, 2004, Pages 707-716

  Sun, Wangping ^a   Pei, Z J ^a   Fisher, G R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Grinding; Machining; Modeling; Semiconductor material; Silicon wafer

Indexed keywords

COMPUTER SOFTWARE; COST EFFECTIVENESS; GRINDING (MACHINING); MATHEMATICAL MODELS; SEMICONDUCTOR MATERIALS;

SILICON INGOTS; WAFER SHAPE;

SILICON WAFERS;

EID: 1842854519     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2004.02.012     Document Type: Article

References (25)

1. Van Zant P. Microchip Fabrication: a Practical Guide to Semiconductor Processing. 2000;37 McGraw-Hill, New York.
2. Tricard M., Kassir S., Herron P., Pei Z.J. New abrasive trends in manufacturing of silicon wafers. Proceeding of the Silicon Machining Symposium, American Society For Precision Engineering, St. Louis, MO, April :1998.
3. Silicon wafer shipments, revenue fell sharply in 2001, East Bay Business Times, 12 February 2002. Available from .
4. B. Mcllvaine, A great 2000, painful 2001, and hope for next year, 2002. Available from .
5. Bawa M.S., Petro E.F., Grimes H.M. Fracture strength of large diameter silicon wafers. Semiconductor International. 18:(11):1995;115-118.
6. T. Fukami, H. Masumura, K. Suzuki, H. Kudo, Method of manufacturing semiconductor mirror wafers, European Patent Application EP0782179A2, 1997.
7. Pei Z.J., Billingsley S.R., Miura S. Grinding-induced subsurface cracks in silicon wafers. International Journal of Machine Tools and Manufacture. 39:(7):1999;1103-1116.
8. Tonshoff H.K., Hartmann M., Klein M. Analysis of grinding marks as a key to ultra-precision surfaces. Proceedings of the Third International Conference on Ultraprecision in Manufacturing Engineering, Aachen, Germany, May :1994;168-171.
9. M. Kulkarni, A. Desai, Silicon wafering process flow, US Patent 6,294,469, 2001.
10. Oh H.S., Lee H.L. A comparative study between total thickness variance and site flatness of polished silicon wafer. Japanese Journal of Applied Physics, Part 1. 40:(9A):2001;5300.
11. Ravi K.V. Materials quality and materials cost - are they on a collision course? Solid State Phenomena. 69-70:1999;103-110.
12. SEMI, Specifications for polished mono-crystalline silicon wafers, SEMI M1-0600, Semiconductor Equipment and Materials International, San Jose, CA, 2000.
13. T. Kato, H. Masumura, S. Okuni, H.H. Kudo, Method of manufacturing semiconductor wafers, European Patent Application EP0798405A2, 1997.
14. R. Vandamme, Y. Xin, Z.J. Pei, Method of processing semiconductor wafers, US Patent 6,114,245, 2000.
15. Chidambaram S., Pei Z.J., Kassir S. Fine grinding of silicon wafers: a mathematical model for grinding marks. International Journal of Machine Tools and Manufacture. 44:(1):2004;11-19.
16. Pei Z.J., Strasbaugh A. Fine grinding of silicon wafers. International Journal of Machine Tools and Manufacture. 41:(5):2001;659-672.
17. Pei Z.J., Strasbaugh A. Fine grinding of silicon wafers: designed experiments. International Journal of Machine Tools and Manufacture. 42:(3):2002;395-404.
18. Chidambaram S., Pei Z.J., Kassir S. Fine grinding of silicon wafers: a mathematical model for the chuck shape. International Journal of Machine Tools and Manufacture. 43:(7):2003;739-746.
19. Oh H.S., Park S.E., Jeong S.M., Kim S.S., Lee H.L. Process induced mechanical damage and fine grinding process parameters. The Fourth International Symposium on Advances in Abrasive Technology (ISAAT'2001), November 6-9, Yonsei University, Seoul, South Korea :2001.
20. Abe K., Okawa S., Koma Y., Arai K. Development of an ultraprecision grinding machine for super-large and super-flat silicon wafers - proposal of trigonal prism type pentahedral structure. Proceedings of Silicon Machining - Spring Topical Meeting, 13-16 April 1998, Carmel-by-the-sea, CA :1998;113-116 American Society for Precision Engineering.
21. Matsui S. An experimental study on the grinding of silicon wafers - the wafer rotation grinding method (1st report). Bulletin of the Japan Society of Precision Engineering. 22:(4):1988;295-300.
22. B. Karpuschewski, S. Lehnicke, Rotation grinding of silicon-wafers, Abrasives Magazine (April/May) (1999) 25-31.
23. Shih A.J., Lee N.L. Precision cylindrical face grinding. Precision Engineering. 23:(3):1999;177-184.
24. Tonshoff H.K., Schmieden W.V., Inasaki I., Konig W., Spur G. Abrasive machining of silicon. CIRP Annals - Manufacturing Technology. 39:(2):1990;621-630.
25. Hinzen H., Ripper B. Precision grinding of semiconductor wafers. Solid State Technology. 26:(8):1993;53-56.