Fine grinding of silicon wafers: Machine configurations for spindle angle adjustments

International Journal of Machine Tools and Manufacture

Volumn 45, Issue 1, 2005, Pages 51-61

  Sun, Wangping ^a   Pei, Z J ^a   Fisher, Graham R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Grinder; Grinding; Machine design; Machining; Semiconductor material; Silicon wafer

Indexed keywords

GRINDING (COMMINUTION); GRINDING MILLS; MACHINE DESIGN; MACHINING; SEMICONDUCTOR MATERIALS;

GRINDING; MACHINE CONFIGURATIONS; SPINDLE ANGLES;

SILICON WAFERS;

EID: 7044245722     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2004.06.013     Document Type: Article

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