Development and Application of Porous Vitrified-Bonded Wheel with Ultra-Fine Diamond Abrasives

Key Engineering Materials

Volumn 257-258, Issue , 2004, Pages 251-256

  Tanaka, T ^a   Esaki, S ^a   Nishida, K ^a   Nakajima, T ^b   Ueno, K ^b  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b Sanwa Kenma Ltd   (Japan)

Author keywords

Diamond Abrasive; Grinding Wheel; Nanometer Scaled Surface; Super Finishing; Ultra Fine Grain; Vitrified Bond

Indexed keywords

ABRASIVES; BEARINGS (MACHINE PARTS); BONDING; DIAMOND CUTTING TOOLS; GRAIN SIZE AND SHAPE; GRAPHITIZATION; HARDNESS; MELTING; METAL FINISHING; POROUS MATERIALS; SINTERING; STEEL; SURFACE ROUGHNESS; VITRIFICATION;

NANOMETER-SCALED SURFACES; SUPER-FINISHING; ULTRA-FINE GRAINS; VITRIFIED-BONDS;

GRINDING WHEELS;

EID: 17644448260     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.257-258.251     Document Type: Article

References (2)

1. N. Yasunaga: Proc. ABTEC2001, 2001, p. 243.
2. T. Tanaka: Diamond wheel grinding technology (Gendai Tosyo, 1999).