Crosstalk attenuation with ground plane structures in Three-dimensionally integrated mixed signal systems

IEEE MTT-S International Microwave Symposium Digest

Volumn 2005, Issue , 2005, Pages 2155-2158

  Kevin Kim, Sang K ^a   Liu, Christianto C ^a   Xue, Lei ^b   Tiwari, Sandip ^a  

^a Cornell University   (United States)

^b Submicron Development Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATTENUATION; COMPUTER SIMULATION; INTEGRATED CIRCUITS; METALLIZING; MOS DEVICES; SIGNAL PROCESSING; TRANSISTORS;

3D INTEGRATED CIRCUITS; CROSSTALK ATTENUATION; GROUND PLANE STRUCTURES; ISOLATION TECHNOLOGY;

CROSSTALK;

EID: 33749248360     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2005.1517176     Document Type: Conference Paper

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