Evaluation of the delamination in a flip chip using anisotropic conductive adhesive films under moisture/reflow sensitivity test

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 551-559

  Ikeda, Toru ^a   Kim, Won Keun ^b   Miyazaki, Noriyuki ^a  

^a KYOTO UNIVERSITY   (Japan)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Anisotropic conductive adhesive films (ACFs); Delamination toughness; Flip chip; Moisture reflow sensitivity test; Reliability; Stress intensity factor

Indexed keywords

ABSORPTION; ADHESION; ANISOTROPY; CONDUCTIVE FILMS; DELAMINATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MOISTURE; SENSITIVITY ANALYSIS; STRESS INTENSITY FACTORS; VAPOR PRESSURE;

ANISOTROPIC CONDUCTIVE ADHESIVE FILMS (ACFS); DELAMINATION TOUGHNESS; MOISTURE/REFLOW SENSITIVITY TEST;

CHIP SCALE PACKAGES;

EID: 33748532173     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880510     Document Type: Article

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