Strength evaluation of electronic plastic packages using stress intensity factors of V-notch

CMES - Computer Modeling in Engineering and Sciences

Volumn 1, Issue 1, 2000, Pages 90-96

  Ikeda, Toru ^a   Arase, Isao ^b   Ueno, Yuya ^b   Miyazaki, Noriyuki ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b NONE

Author keywords

Corner; Electronic packaging; Fracture mechanics; Stress intensity factor

Indexed keywords

EID: 0040524140     PISSN: 15261492     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. Chen, D.; Nishitani, H. (1991): Stress fields near the corner of jointed dissimilar materials. Trans. JSME, Series A, vol. 57, pp. 366-372.
2. Dunn, M. L.; Suwito, W. (1997): Fracture initiation at sharp notches: Correlation using critical stress intensities. Int. J. Solids Structures, vol. 34, pp. 3873-3883.
3. Dunn, M. L.; Suwito, W.; Cunningham, S.; May, C. W. (1997): Fracture initiation at sharp notches under mode I, mode II, and mild mixed mode loading. Int. J. Fracture, vol. 84, pp. 367-381.
4. Hattori, T.; Nishimura, A.; Murakami, G. (1990): A stress singularity parameter approach for evaluating reliability of LSI plastic package. J. Society Material Science, vol. 39, pp. 1101-1105.
5. Ikeda, T.; Komohara, Y.; Miyazaki, N. (1997): Measurement of mixed mode fracture toughness of an interface crack in electronic devises. Advances in Electronic Packaging, ASME EEP., vol. 19, no. 2, pp. 1137-1444.
6. Kitano, M.; Kawai, S.; Nishimura, A.; Nishi, K. (1989): A study of package cracking during the reflow soldering process. Trans. JSME, Series A, vol. 55, pp. 356-363.
7. Nishimura, A.; Hirose, I.; Tanaka, N. (1993): A new method for measuring adhesion strength of IC molding compounds. Trans. JSME Series A, vol. 59, pp. 620-626.
8. Nishimura, A.; Kawai, S.; Murakami, G. (1989): Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling. IEEE Trans. Comp., Hybrids, Manufact. Tech., vol. 12, pp. 639-645.
9. Nishimura, A.; Tatemichi, A.; Miura, H.; Sakamoto, T. (1987): Life estimation for IC plastic packages under temperature cycling based on fracture mechanics. IEEE Trans. Comp., Hybrids, Manufact. Tech., vol. CHMT-12, no. 4, pp. 637-642.
10. Tanaka, N.; Nishiura, A. (1994): Measurement of IC molding compound adhesion strength and prediction of interface delamination within package. Trans. JSME Series A, vol. 60, pp. 1992-1999.
11. Williams, M. L. (1952): Stress singularities resulting from various boundary conditions in angular corners of plates in extension. J. Applied Mechanics, vol. 74, pp. 526-528.