Densely packed optoelectronic interconnect using micromachined springs

IEEE Photonics Technology Letters

Volumn 14, Issue 6, 2002, Pages 846-848

  Chua, Christopher L ^a   Fork, David K ^a   Hantschel, Thomas ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

Integrated optoelectronics; Interconnections; Multichip modules; Semiconductor device packaging; Surface emitting lasers

Indexed keywords

ELECTRIC CONTACTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LASERS; MULTICHIP MODULES; SEMICONDUCTING SILICON; THERMAL CYCLING;

MICROMACHINED SPRINGS; SILICON DRIVER CHIPS; VERTICAL CAVITY SURFACE EMITTING LASER;

INTEGRATED OPTOELECTRONICS;

EID: 0036610810     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2002.1003113     Document Type: Article

References (2)

1. Independently addressable VCSEL arrays on 3 μm pitch
2. A new flip-chip technology for high-density packaging