Intermittency study of a stressed-metal micro-spring sliding electrical contact

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1714-1717

  Chow, Eugene M ^a   Klein, Kevin ^a   Fork, David K ^a   Hantschel, Thomas ^a   Chua, Christopher L ^a   Wong, Lai ^a   Van Schuylenbergh, Koenraad ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; FRETTING CORROSION; METALS; MOLYBDENUM ALLOYS; PRINTED CIRCUIT BOARDS; PROTECTIVE COATINGS; SOLDERING; STRESSES; THERMAL EXPANSION;

FLIP CHIP SOLDERING; INTERMITTENCY; PRESSURE CONTACT; STRESSED-METAL MICRO-SPRING SLIDING ELECTRICAL CONTACT;

ELECTRIC CONTACTS;

EID: 0037674307     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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3. See www.nanonexus.com
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