Flexible micro-spring interconnects for high performance probing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1157-1163

  Haemer, Joseph M ^a   Sitaraman, Suresh K ^a   Fork, David K ^b   Chong, F C ^c   Mok, Sammy ^c   Smith, Donald L ^c   Swiatowiec, Frank ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

^c NanoNexus Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONICS; PLASTIC DEFORMATION; STRESS CONCENTRATION;

FLEXIBLE MICROSPRING INTERCONNECT; NONLINEAR FINITE ELEMENT MODEL; ULTRAFINE PITCH CAPABILITY;

ELECTRIC CONNECTORS;

EID: 0034482897     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)