The development of a novel stacked package: Package in package

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 91-96

  Carson, Flynn ^a   Kim, Young Cheol ^a  

^a ChipPAC Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR PHONES; LAND GRID ARRAYS (LGA); PACKAGE IN PACKAGE (PIP);

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DATA STORAGE EQUIPMENT; RELIABILITY; STANDARDS; STATIC RANDOM ACCESS STORAGE; TRANSFER MOLDING;

CHIP SCALE PACKAGES;

EID: 4644371750     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Karnezos, M, "Package-in-Package (PiP): A new 3-D Module for Wireless Applications", MEPTEC Symposium on "SIPs or SOCs? The Multi-million Dollar Question" Proceedings, The Westin Santa Clara, CA, Feb. 19, 2004.