Interaction kinetics between Sn-Pb solder droplet and Au/Ni/Cu pad

Journal of Materials Science and Technology

Volumn 22, Issue 3, 2006, Pages 392-396

  Li, Fuquan ^a   Wang, Chunqing ^a   Tian, Yanhong ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Aging; Dissolution; Intermetallics; Sn Pb solder droplet

Indexed keywords

AGING OF MATERIALS; CONCENTRATION (PROCESS); COPPER; DIFFUSION; DISSOLUTION; GOLD; INTERFACES (MATERIALS); INTERMETALLICS; KINETIC THEORY; LEAD; NICKEL; TIN;

INTERMETALLIC FORMATION MECHANISM; LIQUID STATE REACTION; SOLDER DROPLET; SOLID STATE REACTION;

SOLDERING;

EID: 33746502063     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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