SCOPUS 정보 검색 플랫폼

Volumn 8, Issue 3, 1998, Pages 209-216

Micro-jet printing of polymers and solder for electronics manufacturing

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONIC PROCESSING; OPTOELECTRONIC DEVICES; POLYMERS; SOLDERING; THERMOSETS;

MICRO-JET PRINTING METHODS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0032261484 PISSN: 09603131 EISSN: None Source Type: Journal
DOI: 10.1142/s0960313198000197 Document Type: Article

Times cited : (63)

References (9)

1
- 0016932121
- Drop formation from a liquid jet: A linear one-dimensional analysis considered as a boundary value problem
- W. T. Pimbley, "Drop formation from a liquid jet: A linear one-dimensional analysis considered as a boundary value problem", IBM J. Res. Dev. 29 (1984), p. 148.
- (1984) IBM J. Res. Dev. , vol.29 , pp. 148
- Pimbley, W.T.¹

2
- 2442723385
- A method of characteristics model of a Drop-on-Demand ink-jet device using an integral method drop formation model
- D. B. Wallace, "A method of characteristics model of a Drop-on-Demand ink-jet device using an integral method drop formation model", ASME 89-WA/FE-4, (1989).
- (1989) ASME 89-WA/FE-4
- Wallace, D.B.¹

3
- 0002683142
- Low cost optical interconnects by microjet printing
- W. R. Cox, D. J. Haves, T. Chen, H.-J. Trost, M. E. Grove, R. F. Hoenigman and D. L. MacFarlane, "Low cost optical interconnects by microjet printing", Int. J. Microcirc. Electro. Packag. 20(2) (1997), 89-95.
- (1997) Int. J. Microcirc. Electro. Packag. , vol.20 , Issue.2 , pp. 89-95
- Cox, W.R.¹ Haves, D.J.² Chen, T.³ Trost, H.-J.⁴ Grove, M.E.⁵ Hoenigman, R.F.⁶ MacFarlane, D.L.⁷

5
- 0027908097
- Picoliter solder droplet dispensing
- D. J. Hayes, D. B. Wallace, M. T. Boldman and R. M. Marusak, "Picoliter solder droplet dispensing", Int. J. Microcirc. and Electro. Packag. 16 (1993), 173-180.
- (1993) Int. J. Microcirc. and Electro. Packag. , vol.16 , pp. 173-180
- Hayes, D.J.¹ Wallace, D.B.² Boldman, M.T.³ Marusak, R.M.⁴

6
- 0004893054
- Solder jet for low cost wafer bumping
- D. J. Hayes, D. B. Wallace and M. T. Boldman, "Solder jet for low cost wafer bumping", Proceedings, ISHM '96, (1996).
- (1996) Proceedings, ISHM '96
- Hayes, D.J.¹ Wallace, D.B.² Boldman, M.T.³

7
- 2442769732
- Solder jet technology update
- D. B. Wallace and D. J. Hayes, "Solder jet technology update", Proceedings, ISHM '97, (1997); and Int. J. Microcirc. Electro. Packag. 21(1) (1998), p. 681.
- (1997) Proceedings, ISHM '97
- Wallace, D.B.¹ Hayes, D.J.²

8
- 2442759145
- D. B. Wallace and D. J. Hayes, "Solder jet technology update", Proceedings, ISHM '97, (1997); and Int. J. Microcirc. Electro. Packag. 21(1) (1998), p. 681.
- (1998) Int. J. Microcirc. Electro. Packag. , vol.21 , Issue.1 , pp. 681

9
- 2442755369
- Solder jet printing for wafer bumping and CSP
- D. J. Haves and D. B. Wallace, "Solder jet printing for wafer bumping and CSP", Proceedings, Surface Mount International (1997), p. 296.
- (1997) Proceedings, Surface Mount International , pp. 296
- Haves, D.J.¹ Wallace, D.B.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.