Accelerated reliability - Thermal and mechanical fatigue solder joints methodologies

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2002, Pages 144-147

  Strifas, Nick ^a   Vaughan, Chris ^a   Ruzzene, Massimo ^b  

^a NAVAL SURFACE WARFARE CENTER   (United States)

^b Department Of Mechanical Engineering ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; RELIABILITY; SOLDERED JOINTS; VISCOPLASTICITY;

MECHANICAL FATIGUE; THERMAL FATIGUE;

FATIGUE TESTING;

EID: 0036089633     PISSN: 00999512     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2002.996627     Document Type: Article

References (9)

1. Constitutive equations for hot-working of metals
2. Effect of simulation methodology on solder joint crack growth correlation
3. Reliability modeling of chip scale packages
4. The use environments of electronic assemblies and their impact on surface mount solder attachment reliability
5. Thermal and power cycling limits of plastic ball grid array (PBGA) assemblies