Integrated flow-thermomechanical and reliability analysis of a densely packed C4/CBGA assembly

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 220-228

  Hong, Bor Zen ^a   Yuan, Tsorng Dih ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PLASTIC DEFORMATION; RELIABILITY; THERMAL CYCLING; THERMODYNAMIC PROPERTIES; THERMOMECHANICAL TREATMENT; VISCOPLASTICITY;

CERAMIC BALL GRID ARRAY; NONLINEAR THERMAL STRESS ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0031636358     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)