-
1
-
-
0026476186
-
Polysilicon as a material for microsensor applications
-
10.1016/0924-4247(92)80210-T 0924-4247 A
-
Obermeier E and Kopystynski P 1992 Polysilicon as a material for microsensor applications Sensors Actuators A 30 149-55
-
(1992)
Sensors Actuators
, vol.30
, Issue.1-2
, pp. 149-155
-
-
Obermeier, E.1
Kopystynski, P.2
-
2
-
-
0000364231
-
Surface micromachining for microsensors and microactuators
-
10.1116/1.584158 0734-211X B
-
Howe R T 1988 Surface micromachining for microsensors and microactuators J. Vac. Sci. Technol. B 6 1809-13
-
(1988)
J. Vac. Sci. Technol.
, vol.6
, Issue.6
, pp. 1809-1813
-
-
Howe, R.T.1
-
3
-
-
0032138470
-
Surface micromachining for microelectromechanical systems
-
10.1109/5.704260 0018-9219
-
Bustillo J M, Howe R T and Muller R S 1998 Surface micromachining for microelectromechanical systems Proc. IEEE 86 1552-74
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1552-1574
-
-
Bustillo, J.M.1
Howe, R.T.2
Muller, R.S.3
-
4
-
-
0032141810
-
Micromachined thermally based CMOS microsensors
-
10.1109/5.704271 0018-9219
-
Baltes H, Paul O and Brand O 1998 Micromachined thermally based CMOS microsensors Proc. IEEE 86 1660-78
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1660-1678
-
-
Baltes, H.1
Paul, O.2
Brand, O.3
-
5
-
-
0343193098
-
Process dependent thin film thermal conductivity for thermal CMOS MEMS
-
10.1109/84.825788 1057-7157
-
Arx M V, Paul O and Baltes H 2000 Process dependent thin film thermal conductivity for thermal CMOS MEMS J. Microelectromech. Syst. 3 136-44
-
(2000)
J. Microelectromech. Syst.
, vol.9
, Issue.1
, pp. 136-144
-
-
Arx, M.V.1
Paul, O.2
Baltes, H.3
-
6
-
-
0024141316
-
A constant temperature gas flowmeter with a silicon micromachined package
-
10.1109/SOLSEN.1988.26429
-
Mastrangelo C H and Muller R S 1988 A constant temperature gas flowmeter with a silicon micromachined package IEEE Solid-State Sensor and Actuator Workshop (Hilton Head) pp 43-6
-
(1988)
IEEE Solid-State Sensor and Actuator Workshop
, pp. 43-46
-
-
Mastrangelo, C.H.1
Muller, R.S.2
-
7
-
-
0030702596
-
Thermoelectric test structures to measure the heat capacity of CMOS layer sandwiches
-
Von Arx M V, Paul O and Baltes H 1997 Thermoelectric test structures to measure the heat capacity of CMOS layer sandwiches Transducers'97 pp 619-22
-
(1997)
Transducers'97
, pp. 619-622
-
-
Von Arx, M.V.1
Paul, O.2
Baltes, H.3
-
8
-
-
0032069607
-
Test structures to measure the heat capacity of CMOS layer sandwiches
-
10.1109/66.670164 0894-6507
-
Von Arx M V, Paul O and Baltes H 1998 Test structures to measure the heat capacity of CMOS layer sandwiches IEEE Trans. Semicond. Manuf. 11 217-24
-
(1998)
IEEE Trans. Semicond. Manuf.
, vol.11
, Issue.2
, pp. 217-224
-
-
Von Arx, M.V.1
Paul, O.2
Baltes, H.3
-
9
-
-
0029275793
-
Determination of the heat capacity of CMOS layers for optimal CMOS sensor design
-
10.1016/0924-4247(94)00935-B 0924-4247 A
-
Von Arx M V, Paul O and Baltes H 1995 Determination of the heat capacity of CMOS layers for optimal CMOS sensor design Sensors Actuators A 47 428-31
-
(1995)
Sensors Actuators
, vol.47
, Issue.1-3
, pp. 428-431
-
-
Von Arx, M.V.1
Paul, O.2
Baltes, H.3
-
10
-
-
0343496784
-
Measurement of thermal conductivity and diffusivity of single and multiplayer membranes
-
10.1016/S0924-4247(98)00284-2 0924-4247 A
-
Irace A and Sarro P M 1999 Measurement of thermal conductivity and diffusivity of single and multiplayer membranes Sensors Actuators A 76 323-8
-
(1999)
Sensors Actuators
, vol.76
, Issue.1-3
, pp. 323-328
-
-
Irace, A.1
Sarro, P.M.2
-
11
-
-
0001257261
-
Thermal diffusivity of heavily doped low pressure chemical vapor deposited polycrystalline silicon films
-
0914-4935
-
Mastrangelo C H and Muller R S 1988 Thermal diffusivity of heavily doped low pressure chemical vapor deposited polycrystalline silicon films Sensors Mater. 3 133-42
-
(1988)
Sensors Mater.
, vol.3
, pp. 133-142
-
-
Mastrangelo, C.H.1
Muller, R.S.2
-
12
-
-
0032304693
-
Analysis of high-order harmonics of temperature wave for Fourier transform thermal analysis
-
10.1143/JJAP.37.L1484 0021-4922
-
Morikawa J and Hashmoto T 1998 Analysis of high-order harmonics of temperature wave for Fourier transform thermal analysis Japan. J. Appl. Phys. 37 1484-7
-
(1998)
Japan. J. Appl. Phys.
, vol.37
, Issue.PART 2
, pp. 1484-1487
-
-
Morikawa, J.1
Hashmoto, T.2
-
13
-
-
0027005375
-
A microstructure for measurement of thermal conductivity of polysilicon thin films
-
10.1109/JMEMS.1992.752511 1057-7157
-
Volklein F and Baltes H 1992 A microstructure for measurement of thermal conductivity of polysilicon thin films J. Microelectromech. Syst. 1 193-6
-
(1992)
J. Microelectromech. Syst.
, vol.1
, Issue.4
, pp. 193-196
-
-
Volklein, F.1
Baltes, H.2
-
14
-
-
0028408991
-
Determination of the thermal conductivity of CMOS IC polysilicon
-
10.1016/0924-4247(94)80106-1 0924-4247 A
-
Paul O, Korvink J and Baltes H 1994 Determination of the thermal conductivity of CMOS IC polysilicon Sensors Actuators A 41-42 161-4
-
(1994)
Sensors Actuators
, vol.41
, Issue.1-3
, pp. 161-164
-
-
Paul, O.1
Korvink, J.2
Baltes, H.3
-
15
-
-
0041386059
-
Electrothermal properties and modeling of polysilicon microthermal actuators
-
10.1109/JMEMS.2003.815835 1057-7157
-
Geisberger A A, Sarkar N and Skidmore G D 2003 Electrothermal properties and modeling of polysilicon microthermal actuators J. Microelectromech. Syst. 12 513-23
-
(2003)
J. Microelectromech. Syst.
, vol.12
, Issue.4
, pp. 513-523
-
-
Geisberger, A.A.1
Sarkar, N.2
Skidmore, G.D.3
-
16
-
-
0030182958
-
Electrothermal responses of lineshape microstructures
-
10.1016/S0924-4247(96)01247-2 0924-4247
-
Lin L and Chiao M 1996 Electrothermal responses of lineshape microstructures Sensors Actuators 55 35-41
-
(1996)
Sensors Actuators
, vol.55
, Issue.1
, pp. 35-41
-
-
Lin, L.1
Chiao, M.2
-
17
-
-
0025839036
-
Thermal assemble of polysilicon microstructures
-
Fedder G K and Howe R T 1991 Thermal assemble of polysilicon microstructures IEEE MEMS (Nara, Japan) pp 63-8
-
(1991)
IEEE MEMS
, pp. 63-68
-
-
Fedder, G.K.1
Howe, R.T.2
-
18
-
-
0033096840
-
Analysis and design of polysilicon thermal flexure actuator
-
0960-1317 308
-
Huang Q A and Lee N K S 1999 Analysis and design of polysilicon thermal flexure actuator J. Micromech. Microeng. 9 64-70
-
(1999)
J. Micromech. Microeng.
, vol.9
, Issue.1
, pp. 64-70
-
-
Huang, Q.A.1
Lee, N.K.S.2
-
19
-
-
0033534289
-
Average power control and positioning of polysilicon thermal actuators
-
10.1016/S0924-4247(98)00211-8 0924-4247
-
Bulter J T, Bright V M and Cowan W D 1999 Average power control and positioning of polysilicon thermal actuators Sensors Actuators 72 88-97
-
(1999)
Sensors Actuators
, vol.72
, Issue.1
, pp. 88-97
-
-
Bulter, J.T.1
Bright, V.M.2
Cowan, W.D.3
-
20
-
-
0032674793
-
Measurement of thermal expansion coefficient of poly-Si using microgauge sensors
-
10.1016/S0924-4247(98)00279-9 0924-4247 A
-
Chae J H, Lee J Y and Kang S W 1999 Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Sensors Actuators A 75 222-9
-
(1999)
Sensors Actuators
, vol.75
, Issue.3
, pp. 222-229
-
-
Chae, J.H.1
Lee, J.Y.2
Kang, S.W.3
|