-
1
-
-
0033346520
-
"An investigation of PCB radiated emissions from simultaneous switching noise"
-
Seattle, WA, Aug
-
S. Radu and D. Hockanson, "An investigation of PCB radiated emissions from simultaneous switching noise," in Proc. IEEE Int. Symp. Electromag. Compat., Seattle, WA, Aug. 1999, pp. 893-898.
-
(1999)
Proc. IEEE Int. Symp. Electromag. Compat.
, pp. 893-898
-
-
Radu, S.1
Hockanson, D.2
-
2
-
-
0035785532
-
"Radiation from printed circuit board edge structures"
-
Montreal, QC, Canada, Aug
-
F. Gisin and Z. Pantic-Tanner, "Radiation from printed circuit board edge structures," in Proc. IEEE Int. Symp. Electromag. Compat., Montreal, QC, Canada, Aug. 2001, pp. 881-883.
-
(2001)
Proc. IEEE Int. Symp. Electromag. Compat.
, pp. 881-883
-
-
Gisin, F.1
Pantic-Tanner, Z.2
-
3
-
-
0036382294
-
"Reduction in radiated emission by symmetrical power-ground stack-up PCB with no open edge"
-
Minneapolis, MN, Aug
-
S. Haga, K. Nakano, and O. Hashimoto, "Reduction in radiated emission by symmetrical power-ground stack-up PCB with no open edge," in Proc. IEEE Int. Symp. Electromag. Compat., Minneapolis, MN, Aug. 2002, pp. 262-267.
-
(2002)
Proc. IEEE Int. Symp. Electromag. Compat.
, pp. 262-267
-
-
Haga, S.1
Nakano, K.2
Hashimoto, O.3
-
4
-
-
2442543385
-
"Modeling, analysis and design of resonant free power distribution network for modern microprocessor systems"
-
Feb
-
O. Mandhana, "Modeling, analysis and design of resonant free power distribution network for modern microprocessor systems," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 107-120, Feb. 2004.
-
(2004)
IEEE Trans. Adv. Packag.
, vol.27
, Issue.1
, pp. 107-120
-
-
Mandhana, O.1
-
5
-
-
0035519080
-
"Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique"
-
Nov
-
B. Archambeault and A. Ruehli, "Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 437-445, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, Issue.4
, pp. 437-445
-
-
Archambeault, B.1
Ruehli, A.2
-
6
-
-
0035519401
-
"Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs"
-
Nov
-
J. Fan, J. Drewniak, J. Knighten, N. Smith, A. Orlandi, T. Van Doren, T. Hubing, and R. DuBroff, "Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 588-599, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, Issue.4
, pp. 588-599
-
-
Fan, J.1
Drewniak, J.2
Knighten, J.3
Smith, N.4
Orlandi, A.5
Van Doren Hubing, T.6
DuBroff, R.7
-
7
-
-
0033343078
-
"Power distribution system design methodology and capacitor selection for modern CMOS technology"
-
Aug
-
L. Smith, R. Anderson, D. Forehand, T. Pelc, and T. Roy, "Power distribution system design methodology and capacitor selection for modern CMOS technology," IEEE Trans. Adv. Packag., vol. 22, no. 3, pp. 284-291, Aug. 1999.
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, Issue.3
, pp. 284-291
-
-
Smith, L.1
Anderson, R.2
Forehand, D.3
Pelc, T.4
Roy, T.5
-
8
-
-
0032072121
-
"Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer system"
-
May
-
W. Becker, J. Eckhardt, R. Frech, G. Katopis, E. Klink, M. McAllister, T. McNamara, P. Muench, S. Richter, and H. Smith, "Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer system," IEEE Trans. Adv. Packag., vol. 21, no. 2, pp. 157-163, May 1998.
-
(1998)
IEEE Trans. Adv. Packag.
, vol.21
, Issue.2
, pp. 157-163
-
-
Becker, W.1
Eckhardt, J.2
Frech, R.3
Katopis, G.4
Klink, E.5
McAllister, M.6
McNamara, T.7
Muench, P.8
Richter, S.9
Smith, H.10
-
9
-
-
9644302160
-
"Power bus decoupling on multilayer printed circuit boards"
-
May
-
T. Hubing, J. Drewniak, T. Van Doren, and D. Hockanson, "Power bus decoupling on multilayer printed circuit boards," IEEE Trans. Electromagn. Compat., vol. 37, no. 2, pp. 155-166, May 1995.
-
(1995)
IEEE Trans. Electromagn. Compat.
, vol.37
, Issue.2
, pp. 155-166
-
-
Hubing, T.1
Drewniak, J.2
Van Doren, T.3
Hockanson, D.4
-
10
-
-
0036589469
-
"Distributed matched bypassing for board-level power distribution networks"
-
May
-
I. Novak, L. Noujeim, V. St Cyr, N. Biunno, A. Patel, G. Korony, and A. Ritter, "Distributed matched bypassing for board-level power distribution networks," IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 230-24, May 2003.
-
(2003)
IEEE Trans. Adv. Packag.
, vol.25
, Issue.2
, pp. 224-230
-
-
Novak, I.1
Noujeim, L.2
St Cyr, V.3
Biunno, N.4
Patel, A.5
Korony, G.6
Ritter, A.7
-
11
-
-
0037297131
-
"Powerbus decoupling with embedded capacitance in printed circuit board design"
-
Feb
-
M. Xu, T. Hubing, J. Chen, T. Van Doren, J. Drewniak, and R. DuBroff, "Powerbus decoupling with embedded capacitance in printed circuit board design," IEEE Trans. Electromagn. Compat., vol. 45, no. 1, pp. 22-30, Feb. 2003.
-
(2003)
IEEE Trans. Electromagn. Compat.
, vol.45
, Issue.1
, pp. 22-30
-
-
Xu, M.1
Hubing, T.2
Chen, J.3
Van Doren, T.4
Drewniak, J.5
DuBroff, R.6
-
12
-
-
0035519745
-
"Power-supply decoupling on fully populated high-speed digital PCBs"
-
Nov
-
V. Ricchiuti, "Power-supply decoupling on fully populated high-speed digital PCBs," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 671-676, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, Issue.4
, pp. 671-676
-
-
Ricchiuti, V.1
-
13
-
-
0033310488
-
"Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination"
-
Aug
-
I. Novak, "Reducing simultaneous switching noise and EMI on ground/ power planes by dissipative edge termination," IEEE Trans. Adv. Packag., vol. 22, no. 3, pp. 274-283, Aug. 1999.
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, Issue.3
, pp. 274-283
-
-
Novak, I.1
-
14
-
-
0035519098
-
"EMI mitigation with multilayer power-bus stacks and via stitching of reference planes"
-
Nov
-
X. Ye, D. Hockanson, M. Li, Y. Ren, W. Cui, J. Drewniak, and R. DuBroff, "EMI mitigation with multilayer power-bus stacks and via stitching of reference planes," IEEE Trans. Electromagn Compat., vol. 43, no. 4, pp. 538-548, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn Compat.
, vol.43
, Issue.4
, pp. 538-548
-
-
Ye, X.1
Hockanson, D.2
Li, M.3
Ren, Y.4
Cui, W.5
Drewniak, J.6
DuBroff, R.7
-
15
-
-
0036382294
-
"Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge"
-
Minneapolis, MN, Aug
-
S. Haga, K. Nakano, and O. Hashimoto, "Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge," in Proc. IEEE Int. Symp. Electromag. Compat., Minneapolis, MN, Aug. 2002, pp. 262-267.
-
(2002)
Proc. IEEE Int. Symp. Electromag. Compat.
, pp. 262-267
-
-
Haga, S.1
Nakano, K.2
Hashimoto, O.3
-
16
-
-
0042863358
-
"The radiation of a rectangular power-bus structure at multiple cavity-mode resonances"
-
Aug
-
M. Leone, "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Trans. Electromagn. Compat., vol. 45, no. 3, pp. 486-492, Aug. 2003.
-
(2003)
IEEE Trans. Electromagn. Compat.
, vol.45
, Issue.3
, pp. 486-492
-
-
Leone, M.1
-
17
-
-
0029288362
-
"Wave model solution to the ground/power plane noise problem"
-
Apr
-
G.-T. Lei, R. Techentin, P. Hayes, D. Schwab, and B. Gilbert, "Wave model solution to the ground/power plane noise problem," IEEE Trans. Instrum. Meas., vol. 44, pp. 300-303, Apr. 1995.
-
(1995)
IEEE Trans. Instrum. Meas.
, vol.44
, pp. 300-303
-
-
Lei, G.-T.1
Techentin, R.2
Hayes, P.3
Schwab, D.4
Gilbert, B.5
-
18
-
-
0033313260
-
"Accuracy considerations of power-ground plane models"
-
San Diego, CA, Oct
-
I. Novak, "Accuracy considerations of power-ground plane models," in Proc. 8th Meeting on Electrical Performance of Electronic Packaging, San Diego, CA, Oct. 1999, pp. 153-156.
-
(1999)
Proc. 8th Meeting on Electrical Performance of Electronic Packaging
, pp. 153-156
-
-
Novak, I.1
-
19
-
-
0035329204
-
"Modeling of simultaneous switching noise in high speed systems"
-
May
-
S. Chun, M. Swaminathan, L. Smith, J. Srinivasan, Z. Jin, and M. Iyer, "Modeling of simultaneous switching noise in high speed systems," IEEE Trans. Adv. Packag., vol. 24, pp. 132-142, May 2001.
-
(2001)
IEEE Trans. Adv. Packag.
, vol.24
, pp. 132-142
-
-
Chun, S.1
Swaminathan, M.2
Smith, L.3
Srinivasan, J.4
Jin, Z.5
Iyer, M.6
-
20
-
-
0032649064
-
"High-frequency characterization of power/ground-plane structures"
-
May
-
G.-T. Lei, R. Techentin, and B. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory Tech., vol. 47, pp. 562-569, May 1999.
-
(1999)
IEEE Trans. Microw. Theory Tech.
, vol.47
, pp. 562-569
-
-
Lei, G.-T.1
Techentin, R.2
Gilbert, B.3
-
21
-
-
0033681359
-
"Development of a closed-form expression for the input impedance of power-ground plane structures"
-
Washington, DC, Aug
-
M. Xu, Y. Ji, T. Hubing, J. Drewniak, and T. Van Doren, "Development of a closed-form expression for the input impedance of power-ground plane structures," in Proc. IEEE Int. Symp. Electromag. Compat., Washington, DC, Aug. 2000, pp. 77-82.
-
(2000)
Proc. IEEE Int. Symp. Electromag. Compat.
, pp. 77-82
-
-
Xu, M.1
Ji, Y.2
Hubing, T.3
Drewniak, J.4
Van Doren, T.5
-
22
-
-
0038618708
-
"Application of the cavity model to lossy power-return plane structures in printed circuit boards"
-
Feb
-
M. Xu, H. Wang, and T. Hubing, "Application of the cavity model to lossy power-return plane structures in printed circuit boards," IEEE Trans. Adv. Packag., vol. 26, no. 1, pp. 73-80, Feb. 2003.
-
(2003)
IEEE Trans. Adv. Packag.
, vol.26
, Issue.1
, pp. 73-80
-
-
Xu, M.1
Wang, H.2
Hubing, T.3
-
23
-
-
0036706222
-
"Estimating the power bus impedance of printed circuit boards with embedded capacitance"
-
Aug
-
M. Xu and T. Hubing, "Estimating the power bus impedance of printed circuit boards with embedded capacitance," IEEE Trans. Adv. Packag., vol. 25, no. 3, pp. 424-432, Aug. 2002.
-
(2002)
IEEE Trans. Adv. Packag.
, vol.25
, Issue.3
, pp. 424-432
-
-
Xu, M.1
Hubing, T.2
-
24
-
-
0018442043
-
"Theory and experiment on microstrip antennas"
-
Mar
-
Y. T. Lo, D. Solomon, and W. F. Richards, "Theory and experiment on microstrip antennas," IEEE Trans. Antennas Propag., vol. 27, pp. 137-145, Mar. 1979.
-
(1979)
IEEE Trans. Antennas Propag.
, vol.27
, pp. 137-145
-
-
Lo, Y.T.1
Solomon, D.2
Richards, W.F.3
-
25
-
-
0004035192
-
-
2nd ed. New York: Wiley chs. 3 and 14
-
C. A. Balanis, Antenna Theory, 2nd ed. New York: Wiley chs. 3 and 14, 1997.
-
(1997)
Antenna Theory
-
-
Balanis, C.A.1
-
28
-
-
0031077053
-
"Via coupling within parallel rectangular planes"
-
Feb
-
J. Parker, "Via coupling within parallel rectangular planes," IEEE Trans. Electromagn. Compat., vol. 39, pp. 17-23, Feb. 1997.
-
(1997)
IEEE Trans. Electromagn. Compat.
, vol.39
, pp. 17-23
-
-
Parker, J.1
-
30
-
-
0036589413
-
"Reducing power bus impedance at resonance with lossy components"
-
May
-
T. Zeeff and T. Hubing, "Reducing power bus impedance at resonance with lossy components," IEEE Trans. Adv. Packag., vol. 25, pp. 307-310, May 2002.
-
(2002)
IEEE Trans. Adv. Packag.
, vol.25
, pp. 307-310
-
-
Zeeff, T.1
Hubing, T.2
|