Power-bus decoupling with embedded capacitance in printed circuit board design

IEEE Transactions on Electromagnetic Compatibility

Volumn 45, Issue 1, 2003, Pages 22-30

  Xu, Minjia ^a   Hubing, Todd H ^b   Chen, Juan ^c   Van Doren, Thomas P ^b   Drewniak, James L ^b   DuBroff, Richard E ^b  

^a HEWLETT PACKARD COMPANY   (United States)

^b Architectural and Environmental Engineering   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Conduction loss; Decoupling capacitor; Embedded capacitance (buried capacitance); Power plane; Power bus decoupling; Power bus impedance; Power bus noise (delta I noise, ground bounce noise, simultaneous switch noise); Return plane

Indexed keywords

CAPACITANCE; DAMPING; DIELECTRIC MATERIALS; ELECTRIC IMPEDANCE; INDUCTANCE; MULTICARRIER MODULATION; SIGNAL INTERFERENCE;

EMBEDDED CAPACITANCE;

PRINTED CIRCUIT BOARDS;

EID: 0037297131     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2002.808075     Document Type: Article

References (6)

1. T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, "Power-bus decoupling on multi-layer printed circuit boards," IEEE Trans. Electromagn. Compat., vol. 37, pp. 155-166, May 1995.
2. J. Sisler, "Eliminating capacitors from multi-layer PCB's," Printed Circuit Des., vol. 8, no. 7, pp. 14-23, 1991.
3. V. Ricchiuti, A. Orlandi, and G. Antonini, "Buried capacitance technology for power-bus decoupling on high speed digital PCB's," in Proc. 14th Int. Zurich Symp. Electromagnetic Compatibility, Zurich, Switzerland, Feb. 2001.
4. "Embedded decoupling capacitance (edc) project-Final Report," National Center for Manufacturing Sciences, Ann Arbor, MI, Final Rep. 0091RE00, 2000.
5. T. H. Hubing, M. Xu, J. Chen, J. L. Drewniak, T. P. Van Doren, and R. E. DuBroff, "Mitigating power-bus noise with embedded capacitance in PCB designs," in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Aug. 2001, pp. 496-500.
6. M. Xu, T. H. Hubing, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, "Modeling printed circuit boards with embedded decoupling capacitance," in Proc. 14th Int. Zurich Symp. Electromagnetic Compatibility, Zurich, Switzerland, Feb. 2001.