Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2002, Pages 262-267

  Haga, Satoru ^a   Nakano, Ken ^a   Hashimoto, Osamu ^b  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Multi layer PCB; Power and ground plane resonance; Radiated emission; Symmetrical layer stack up

Indexed keywords

CAPACITANCE; ELECTROMAGNETISM; FREQUENCIES; RADIATION; RESONANCE;

POWER-GROUND PLANE RESONANCE; RADIATED EMISSION;

PRINTED CIRCUIT BOARDS;

EID: 0036382294     PISSN: 01901494     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISEMC.2002.1032486     Document Type: Article

References (6)

1. S. Haga, K. Nakano, and O.Hashimotoo, "Effects of Power-Ground plane Structure on Radiated Emission from PCB", 2002 International Conference on Electronics Packaging, pp.453-458, April 2001.
2. Franz Gisin, and Zorica Pantic-Tanner, "Radiation from Printed Circuit Board Edge Structure", IEEE EMC symposium Montreal pp. 881-883, August 2001.
3. th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, pp.697-700, February 2001.
4. Todd Hubing, M.Xu, J.Drewniak, T.Van Doren and R. duBroff, "Printed Circuit Board Power Bus Decoupling using Embedded Capacitance", IEEE EMC symposium, Washington, 2000.
5. Istvan Novak, "Lossy Power Distribution Networks with Thin Dielectric Layers and/or Thin Conductive Layers", IEEE Transaction on Advanced Packaging, vol.23, no.3. pp.353-360, August 2000.
6. J.R. James, P.S. hall, and C. Wood, Microstrip Antenna Theory and Design, IEE Electronagnetic Waves Series 12, Stevenage, UK, and New York, Peter Peregrinus, 1981.