Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition

Journal of Applied Physics

Volumn 93, Issue 2, 2003, Pages 1257-1261

  Pyo, Sung Gyu ^a   Kim, Sibum ^a   Wheeler, D ^b   Moffat, T P ^b   Josell, D ^b  

^a Hynix Semiconductor Inc   (South Korea)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; CATALYSTS; CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; COPPER; IODINE; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

SUPERCONFORMAL FILLINGS;

ELECTROCHEMISTRY;

EID: 0037439465     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1532931     Document Type: Article

References (19)

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