Characterization of additive systems for damascene Cu electroplating by the superfilling profile monitor

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 6, 2000, Pages 2835-2841

  Chiu, Shao Yu ^a   Shieh, Jia Min ^b   Chang, Shih Chieh ^a   Lin, Kun Cheng ^a   Dai, Bau Tong ^b   Chen, Chia Fu ^a   Feng, Ming Shiann ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; CATHODES; COPPER; DIFFUSION; DYNAMICS; ELECTRON MICROSCOPY; POLARIZATION;

ADDITIVE SYSTEMS; CYCLIC VOLUMETRIC STRIPPING MEASUREMENTS;

ELECTROPLATING;

EID: 0034318645     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1322042     Document Type: Article

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