Wafer bonding of lead zirconate titanate to Si using an intermediate gold layer for microdevice application

Journal of Micromechanics and Microengineering

Volumn 16, Issue 4, 2006, Pages 815-820

  Tanaka, Katsuhiko ^a   Konishi, Takahiro ^a   Ide, Masato ^a   Sugiyama, Susumu ^a  

^a RITSUMEIKAN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; GOLD; SENSORS; SILICON; THIN FILMS; WSI CIRCUITS;

BONDING TEMPERATURE; FRACTURE MECHANISM; MICRODEVICE APPLICATION;

LEAD COMPOUNDS;

EID: 33645063708     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/4/019     Document Type: Article

References (14)

1. Hsu Y C, Wu C C, Lee C C, Cao G Z and Shen I Y 2004 Demonstration and characterization of PZT thin-film sensors and actuators for meso- and micro-structures Sensors Actuators A 116 369-77
2. Yamashita K, Chansomphou L, Murakami H and Okuyama M 2004 Ultrasonic micro array sensors using piezoelectric thin films and resonant frequency tuning Sensors Actuators A 116 147-53
3. 3 thin film cantilever and bridge acoustic sensors for miniaturized photoacoustic gas detectors J. Micromech. Microeng. 14 1650-8
4. Köhler J, Bejhed J, Kratz H, Bruhn F, Lindberg U, Hjort K and Stenmark L 2002 A hybrid cold gas microthruster system for spacecraft Sensors Actuators A 97-98 587-98
5. Roberts D C, Li H, Steyn J L, Turner K T, Mlcak R, Saggere L, Spearing S M, Schmidt M A and Hagood N W 2002 A high-frequency, high-stiffness piezoelectric actuator for microhydraulic applications Sensors Actuators A 97-98 620-31
6. 12 by Ar-beam surface activation J. Micromech. Microeng. 11 348-52
7. Tanaka K, Takata E and Owada K 1998 Anodic bonding of lead zirconate titanate ceramics to silicon with intermediate glass layer Sensors Actuators A 69 199-203
8. Chung G S and Kim J M 2004 Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications Sensors Actuators A 116 352-6
9. Tanaka K, Konishi T, Kuze W and Sugiyama S 2004 Bonding of lead zirconate titanate ceramics to Si single crystals for Microdevices Japan. J. Appl. Phys. 43 6672-4
10. 3 bulk ceramics to Si single crystals Proc. 21st Sensor Symp. (Kyoto, Japan) pp 469-72
11. Tiensuu A L, Bexell M, Schweitz J A, Smith L and Johansson S 1994 Assembling three-dimensional microstructures using gold-silicon eutectic bonding Sensors Actuators A 45 227-336
12. Wolffenbuttel R F and Wise K D 1994 Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature Sensors Actuators A 43 223-9
13. Vallin, Jonsson K and Lindberg U 2005 Adhesion qualification methods for wafer bonding Mater. Sci. Eng. R 50 109-65
14. Wolffenbuttel R F 1997 Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond Sensors Actuators A 62 680-6