Morphology and adhesion strength of the Sn-9Zn-3.5Ag/Cu interface after aging

Journal of Crystal Growth

Volumn 263, Issue 1-4, 2004, Pages 223-231

  Chang, Tao Chih ^a   Wang, Moo Chin ^b   Hon, Min Hsiung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

A1. Decomposition; A1. Interface; A1. Microvoid; A1. Morphology; B2. Intermetallic compound

Indexed keywords

ADHESION; AGING OF MATERIALS; DECOMPOSITION; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

MICROVOIDS; SOLDER JOINTS;

INTERMETALLICS;

EID: 1242286477     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcrysgro.2003.05.002     Document Type: Article

References (16)

1. McCormack M., Kammlott G.W., Chen H.S., Jin S. Appl. Phys. Lett. 65:1994;1100.
2. Shohji I., Nakamura T., Mori F., Fujiuchi S. Mater. Trans. 43:2002;1797.
3. Suganuma K., Murata T., Noguchi H., Toyoda Y. J. Mater. Res. 15:2000;884.
4. K.S. Kim, T.S. Kirn, C.W. Hwang, S.H. Huh, K. Suganuma, H. Nakajima, Proceedings of the 11th Micro Electronic Symposium, Japan Institute of Electronics Packaging, 2001, pp. 255-258.
5. Chang T.C., Wang M.C., Hon M.H. J. Crystal Growth. 252:2003;391.
6. Chang T.C., Hon M.H., Wang M.C. J. Crystal Growth. 252:2003;401.
7. Chang T.C., Wang M.C., Hon M.H. J. Crystal Growth. 250:2003;236.
8. T.C. Chang, M.H. Hon, M.C. Wang, J. Electron. Mater, in press.
9. Yu S.P., Lin H.J., Hon M.H., Wang M.C. J. Mater. Sci. 11:2000;461.
10. K. Shimano, N. Sato, S. Takahashi, Proceedings of the sixth Symposium on Microjoining and Assembly Technology in Electronics, The Japan Welding Society, 2000, pp. 884-891.
11. T.C. Chang, M.C. Wang, M.H. Hon, Metall. Mater. Trans A., submitted for publication.
12. Cheng S.C., Lin K.L. J. Electron. Mater. 31:2002;940.
13. Tu K.N., Lee T.Y., Jang J.W., Li L., Frear D.R., Zeng K., Kivilahti J.K. J. Appl. Phys. 89:2001;4843.
14. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys, American Society for Metals, Metals Park, OH, 1973, p. 795.
15. Yang W., Messier R.W. Jr., Felton L.E. J. Electron. Mater. 23:1994;765.
16. Pang H.L.J., Tan K.H., Shi X.Q., Wang Z.P. Mater. Sci. Eng. A307:2001;42.