Thermal characteristics and intermetallic compounds formed at Sn-9Zn-0.5Ag/Cu interface

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 606-613

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Bi structure; Fusion heat; Intermetallic compounds; Melting point; Thermal characteristics

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DISSOLUTION; ELECTRON DIFFRACTION; INTERFACES (MATERIALS); MELTING; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

BI STRUCTURE; FUSION HEAT; MELTING POINT; THERMAL CHARACTERSTICS;

INTERMETALLICS;

EID: 2442466830     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.606     Document Type: Article

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