Interconnect modeling and analysis in the nanometer era: Cu and beyond

Advanced Metallization Conference (AMC)

Volumn , Issue , 2006, Pages 25-31

  Banerjee, Kaustav ^a   Im, Sungjun ^b   Srivastava, Navin ^a  

^a University of California   (United States)

^b Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; NUMERICAL ANALYSIS; RELIABILITY; VLSI CIRCUITS; COPPER; NANOSTRUCTURED MATERIALS; TECHNOLOGY TRANSFER;

INTERCONNECT MODELING; PARASITIC EXTRACTION; POWER DISSIPATION;

LARGE SCALE SYSTEMS; INTERCONNECTION NETWORKS;

EID: 33644945678     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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