Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Journal of Materials Research

Volumn 18, Issue 4, 2003, Pages 935-940

  Huang, Chien Sheng ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; ELECTROPLATING; EUTECTICS; METALLIZING; MULTILAYERS; NICKEL; PHASE EQUILIBRIA; TIN COMPOUNDS;

ELECTRON PROBE MICROANALYSIS;

INTERFACES (MATERIALS);

EID: 0038337817     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0128     Document Type: Article

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