Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 98-104

  Huang, Zhiheng ^a   Conway, Paul P ^a   Liu, Changqing ^a   Thomson, Rachel C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Flip chip interconnection; Intermetallics; Solders; Thermodynamics

Indexed keywords

FLIP CHIP DEVICES; INTERMETALLICS; MATHEMATICAL MODELS; OPTIMIZATION; PHASE COMPOSITION; PHASE TRANSITIONS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMODYNAMIC STABILITY; TIN ALLOYS;

FLIP CHIP INTERCONNECTION; MASS FRACTION; PHASE FORMATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 33644800716     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.850538     Document Type: Article

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