Effect of under bump metallurgy and reflows on shear strength and microstructure of joint between Cu substrate and Sn-36Pb-2Ag solder alloy

Materials Transactions

Volumn 44, Issue 2, 2003, Pages 290-297

  Yoon, Seung Wook ^a   Kim, Jong Hoon ^b   Jeong, Sang Won ^b   Lee, Hyuck Mo ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Interfacial intermetallic compound; Interfacial reaction; Joint microstructure; Solder joint strength; Tin lead silver solder; Under bump metallurgy

Indexed keywords

BOND STRENGTH (MATERIALS); COPPER; CRYSTAL MICROSTRUCTURE; ELECTROPLATING; INTERFACES (MATERIALS); INTERMETALLICS; METALLURGY; SHEAR STRENGTH; SILVER COMPOUNDS; SOLDERING ALLOYS; TIN ALLOYS;

BALL SHEAR TESTER; INTERFACIAL REACTION; SOLDER JOINT STRENGTH; SOLDER JOINTS; UNDER BUMP METALLURGY;

SOLDERED JOINTS;

EID: 0038643543     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.44.290     Document Type: Article

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