Analysis of the micro- mechanical properties in aged lead-free, fine pitch flip chip joints

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 147-153

  Liu, Changqing ^a   Conway, Paul ^a   Li, Dezhi ^a   Hendriksen, Michael ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Celestica Limited   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COMPOSITE MICROMECHANICS; ELECTROLESS PLATING; ELECTRON DEVICE MANUFACTURE; INTERFACES (MATERIALS); PRINTED CIRCUIT BOARDS; SHEAR STRENGTH; SOLDERING ALLOYS; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; FLIP CHIP DEVICES; GRAIN GROWTH; INDENTATION; MECHANICAL PROPERTIES; PHASE INTERFACES; PRINTED CIRCUIT MANUFACTURE; SOLDERING; STRESS CONCENTRATION; TIN;

MICRO-MECHANICAL BEHAVIOR; NANO-TESTING; AGING PROCESS; ASSEMBLY PROCESS; ELECTROLESS NICKEL; FINAL ASSEMBLY; FINE FEATURE; FINE-PITCH FLIP CHIP; FLIP CHIP; JOINT RELIABILITY; LEAD-FREE; MICRO-SHEAR TESTING; MICROMECHANICAL BEHAVIOR; NANOINDENTATION TECHNIQUES; NANOTESTING; RECRYSTALLIZATIONS; REFLOW--SOLDERING; RICH STRUCTURE; SHEAR TESTS; SNAGCU SOLDER; SOLDER BUMP; SOLDER PASTE;

FLIP CHIP DEVICES; SOLDERING ALLOYS;

EID: 1242264774     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35130     Document Type: Conference Paper

References (8)

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