FLO/STRESS: An integrated software module to predict stress in electronic products

Computing and Control Engineering Journal

Volumn 13, Issue 3, 2002, Pages 143-148

  Bailey, C ^a   Warner, M ^a   Agha, A ^a   Pericleous, K ^a   Parry, J ^a   Marooney, C ^a   Reeves, H ^a   Clark, I ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTATIONAL METHODS; COMPUTER AIDED ANALYSIS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; CONSUMER ELECTRONICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; STRESS ANALYSIS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL STRESS;

SOLID MECHANICS; THERMAL DESIGN TOOLS;

COMPUTER SOFTWARE;

EID: 0036610886     PISSN: 09563385     EISSN: None     Source Type: Journal    
DOI: 10.1049/cce:20020306     Document Type: Article

References (7)

1. SOP: The microelectronics for the 21st century with integral passive integration
2. Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: The C4/ceramic-ball-grid array interconnect technology
3. The development of component-level thermal compact models of a C4/CBGA interconnect technology: The Motorola PowerPC 603 and 604 RISC processors
4. Reliability analysis of flip chip designs via computer simulation