The microstructure and properties of solder joints

Journal of the Korean Physical Society

Volumn 35, Issue SUPPL. 2, 1999, Pages

  Morris Jr , J W ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033418553     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

1. J. W. Morris, Jr., J. L. Freer-Goldstein and Z. Mei, in The Mechanics of Solder Alloy Interconnects, eds. S. N. Burchett, D. R. Frear, H. S. Morgan and J. H. Lau (Publishers: Van Nostrand Reinhold, New York, 1993).
2. Z. Mei, J. W. Morris, Jr., M. C. Shine and T. S. E. Summers, Journal of Electronic Materials 20, 599 (1991).
3. D. Grivas, Ph.D. Thesis, Dept. Materials Science, Univ. California, Berkeley, 1978.
4. Z, Mei and J. W. Morris, Jr., Trans. ASME 114, 104 (1992)
5. D. R. Frear, Ph.D. Thesis, Dept. Materials Science, Univ. California, Berkeley, 1987;
6. and D. R. Frear, D. Grivas and J. W. Morris, Jr., J. Electronic Mater. 18, 671 (1989).
7. D. Tribula, Ph.D. Thesis, Dept. Materials Science, Univ. California, Berkeley, 1990;
8. and D. Tribula and J. W. Morris, Jr., ASME Journal of Electronic Packaging 112, 87 (1990).
9. M. Barney, Univ. California, Berkeley, unpublished work, 1998.
10. S. Liu and Y. H. Mei, Soldering and Surface Mount Technology 18, 21 (1994).
11. C. Gonzales, MS Thesis, Dept. Materials Science, Univ. California, Berkeley, 1998.