SCOPUS 정보 검색 플랫폼

Volumn 66, Issue 8, 2002, Pages 799-807

Influence of silver addition and reflow cooling rate on microstructure and strength of tin-lead system solder ball bonding

Author keywords

Cooling rate; Hardness; Lanmella; Reflow; Shear; Solder ball; Tin lead

Indexed keywords

BRITTLE FRACTURE; COOLING; EUTECTICS; HARDNESS; INTERFACES (MATERIALS); MICROSTRUCTURE; SHEAR STRENGTH; SILVER; TIN ALLOYS;

SOLDER BALL BONDING;

SOLDERING ALLOYS;

EID: 0036699790 PISSN: 00214876 EISSN: None Source Type: Journal
DOI: 10.2320/jinstmet1952.66.8_799 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.