Influence of Sb addition on microstructural evolution of Sn-Ag solder

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 139-144

  Lee, Hwa Teng ^a   Chen, Ming Hung ^a   Hu, Shuen Yuan ^a   Li, Cheng Shyan ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Ag3(Sb,Sn); IMC; SbSn; Sn Ag Sb solder

Indexed keywords

ANTIMONY COMPOUNDS; ATOMS; COOLING; MICROSTRUCTURAL EVOLUTION; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SILVER;

CONSTANT VALUES; COOLING RATES; LAMINATED STRUCTURES; NON-STOICHIOMETRY; SBSN; SOLDER JOINTS; STRENGTH AND DUCTILITIES; SUBSTANTIAL REDUCTION;

TIN;

EID: 84966546576     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188827     Document Type: Conference Paper

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