Reliability test chips: NIST 33 & NIST 34 for JEDEC inter-laboratory experiments and more

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1997, Pages 144-145

  Schafft, Harry A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; LATTICE CONSTANTS; PASSIVATION; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; X RAY DIFFRACTION;

PROBE PAD ARRAY; X RAY DIFFRACTION MEASUREMENT;

RELIABILITY;

EID: 0031346087     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)