A practical methodology for multi-modality electromigration lifetime prediction

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 50-54

  Lin, M H ^a   Yang, G S ^a   Lin, Y L ^a   Lin, M T ^a   Lin, C C ^a   Yeh, M S ^a   Chang, K P ^a   Su, K C ^a   Chen, J K ^a   Chang, Y J ^a   Wang, Tahui ^b  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; FAILURE (MECHANICAL); INTEGRATED CIRCUIT INTERCONNECTS;

COMPLEX FAILURE; DAMASCENE CU INTERCONNECTS; DUAL DAMASCENE; DUAL DAMASCENE INTERCONNECT; ELECTROMIGRATION BEHAVIOR; ELECTROMIGRATION FAILURE MECHANISM; FAILURE BEHAVIORS; FAILURE MODELLING; LIFETIME PREDICTION; MULTI-MODALITY;

ELECTROMIGRATION;

EID: 84949233038     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194232     Document Type: Conference Paper

References (2)

1. C-K. Huetal.,AMCConf.Sept.28-30, 1999.
2. A.H. Fischer et al "IRPS 2001" "Experimental Data and Statistical Models for Bimodal EM Failures"