Copper interconnect: Fabrication and reliability

International Symposium on VLSI Technology, Systems, and Applications, Proceedings

Volumn , Issue , 1997, Pages 18-22

  Hu, C K ^a   Harper, J M E ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMIGRATION; POLYIMIDES;

MULTILEVEL COPPER CHIP INTERCONNECTIONS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030691604     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (47)