Relationship between interfacial adhesion and electromigration in Cu metallization

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 32-35

  Lloyd, J R ^a   Lane, M W ^a   Liniger, E G ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM ALLOYS; COMMERCE; COPPER; ELECTROMIGRATION; GRAIN BOUNDARIES; SILICA; SILICON CARBIDE; SILICON NITRIDE;

AL-ALLOY; CU CONDUCTOR; CU METALLIZATION; DRIFT VELOCITIES; DRIFT VELOCITY MEASUREMENTS; GRAIN-BOUNDARIES; INTERFACIAL ADHESIONS; LIFETIME STUDIES; POOR ADHESION; UPPER SURFACE;

VELOCITY;

EID: 0842306725     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194228     Document Type: Conference Paper

References (14)

1. J.R. Lloyd and J.J. Clement, Thin Solid Films, 262, L35 (1995)
2. c.-k. Hu, R. Rosenberg and k.l. Lee, Appl. Phys. Lett., 74, 2945 (1999)
3. R. Rosenberg, d.c. Edelstein, c.-k. Hu and k.p, Rodbell, Annu. Rev. Mater. Sci., 30, 229 (2000)
4. D. Edelstein, et. al., Proc. International Interconnect Technology Conference, (2001)
5. R. H. Dauskardt, M. Lane, Q. Ma and N. Krishna, Eng. Fract. Mech. 61, 141 (1998)
6. M. Lane, N, Krishna, I. Hashim and R. H. Dauskardt, J. Mat. Res. 15, 203 (2000).
7. C. Zener, in W. Shockley (ed.), p. 289, "Imperfections in Nearly Perfect Crystals," J. Wiley, New York 1952.
8. R. W. Hertzberg, p. 239, "Deformation and Fracture Mechanics of Engineering Materials," J. Wiley, New York 1989.
9. M. Lane, submitted to Appl. Phys. Lett., July 2002.
10. P. G Shewmon, p. 65, "Diffusion in Solids," McGraw-Hill, New York, 1963.
11. M. Lane, R. H. Dauskardt, A. Vainchtein and H. GaoJ Mater. Res., 15, 2758 (2000).
12. J. Merikoski, I. Vattulainen, J. Heinonen andT.Ali-Nissila, Surface Science, 387, 167 (1997)
13. Handbook of Grain and Interphase Boundary Diffusion Data. I. Kaur and W. Gust, Ziegler Press, Stuttgart (1989)
14. Handbook of Chemistry and Physics. 72™ Edition. Edited by D. Lide.