Test chips for die stress characterization using arrays of CMOS sensors

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 1999, Pages 147-150

  Bradley, A T ^a   Jaeger, R C ^a   Suhling, J C ^a   Zou, Y ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CMOS INTEGRATED CIRCUITS; DIES; ELECTRONICS PACKAGING; FIELD EFFECT TRANSISTORS; SENSORS; STRESSES; TEMPERATURE;

DIE STRESS CHARACTERIZATION; EPOXY CURE TEMPERATURE; LIQUID NITROGEN; STRESS SENSORS;

INTEGRATED CIRCUIT TESTING;

EID: 0032597880     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)