In-situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 973-978

  Mayer, Michael ^a   Schwizer, Jürg ^a   Paul, Oliver ^b   Bolliger, Daniel ^c   Baltes, Henry ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF FREIBURG   (Germany)

^c Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345771512     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

1. Bittle, D. A., Suhling, J. C., Beaty, R. E., Jaeger, R. C., Johnson, R. W., 1991, "Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages," ASME Journal of Electronic Packaging, Vol. 113, pp. 203-215.
2. Budweiser, W., 1993, "Untersuchung des Thermosonic-Ballbondverfahrens," Thesis, Technical University Berlin, pp. 103-110.
3. Felber, A., and Nehls, W., 1992, "Method and Apparatus for Measuring the Vibration Amplitude on an Energy Transducer," European Patent No. 0 498 936 B1, Aug. 8, 1992, U. S. Patent 5,199,630, Apr. 6, 1993.
4. Funk, J. M., Bomholt, L. H., Paganini, R. P, Lien, H.-P., Fichtner, W., 1997, "SOLIDIS: A TCAD Environment for Packaging Simulation," Proceedings, ASME Advances in Electronic Packaging InterPACK'97, pp. 919-926.
5. Hamilton, G. M., and Goodman, L. E., 1966, "The Stress Field Created by a Circular Sliding Contact," ASME Journal of Applied Mechanics, Vol. 33, pp. 371-376.
6. Harman, G. G., 1997, "Wire Bonding in Microelectronics," 2nd ed., McGraw-Hill, New-York.
7. Kang, S.-Y., Chuang, K., Lee, Y. C., 1998, "Random Change of Vibration Modes in Thermosonic Bonding," ASME Journal of Electronic Packaging, Vol. 120, pp. 253-258.
8. Lang, K.-D., Osterwald, F., Schilde, B., Reichl, H., 1998, "Measurement of Ultrasonic Behavior during Wire Bonding - a Contribution to Quality Assurance in Chip on Board Technology," Proceedings, Semicon West '98, pp. F1-F9.
9. Mayer, M., Paul, O., and Baltes, H., 1998a, "In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors," Proceedings, IMAPS Emerging Microelectronics and Interconnection Technologies EMIT'98, pp. 129-133.
10. Mayer, M., Paul, O., Bolliger, D., and Baltes, H., 1998b, "In-Situ Calibration Of Wire Bonder Ultrasonic System Using Integrated Microsensor," Proceedings, IEEE Electronic Packaging Technology Conference EPTC'98, pp. 219-223.
11. Mayer, M., Paul, O., Bolliger, D., and Baltes, H., 1999, "Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process", accepted for publication, IEEE 49th Electronic Components and Technology Conference ECTC'99.
12. Osterwald, F., 1997, "Vibrationsmessungen beim US-Drahtbonden," 4. Laser Vibrometer Seminar, Waldborn, Germany.
13. Pufall, R., 1993, "Automatic Process Control of Wire Bonding," Proceedings, 43th IEEE Electronic Components and Technology Conference ECTC'93, pp. 159-162.