In-situ calibration of wire bonder ultrasonic system using integrated microsensor

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 219-223

  Mayer, Michael ^a   Paul, Oliver ^a   Bolliger, Daniel ^a   Baltes, Henry ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CALIBRATION; ELECTRIC WIRE; FRICTION; INTEGRATED CIRCUIT TESTING; MICROPROCESSOR CHIPS; MICROSENSORS; ULTRASONIC DEVICES;

INTEGRATED MICROSENSORS; WIRE BONDER ULTRASONIC SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0032230717     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)